The liquid metal cooling solution in the PS5 is not the kind of liquid cooling you find on high-end PCs that involves the use of liquid (not liquid metal) and pipes to move heat away from components generating heat.
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Playstation 5: Thread 02
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Originally posted by wakka View PostNah, it didn’t. That was an early rumour though.
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Originally posted by bcass View PostAccording to this page (https://gamesx.com/dreamcast/index2.htm) first edition Japanese Dreamcasts did use a simple form of liquid pipe cooling.
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Originally posted by bcassAccording to this page (https://gamesx.com/dreamcast/index2.htm) first edition Japanese Dreamcasts did use a simple form of liquid pipe cooling.
Originally posted by Team AndromedaIt did. EDGE Magine even did a tech breakdown in the DC Special supplement
I've been labouring under the impression for 20 years that that was an erroneous rumour! TIL
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I think the liquid metal in the PS5 is the thermal paste between the APU and heat sink. That stuff isn’t cheap and massive heat sink and pipes combo would have been pricey.
Have to say the Series X seems like a more elegant design which is surprising given Sony has been hardware since long before MS existed.
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Originally posted by CMcK View PostI think the liquid metal in the PS5 is the thermal paste between the APU and heat sink. That stuff isn’t cheap and massive heat sink and pipes combo would have been pricey.
Have to say the Series X seems like a more elegant design which is surprising given Sony has been hardware since long before MS existed.
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Originally posted by Cassius_Smoke View PostMS has very much gone down the PC hardware build route. Basically get your components together and neatly pack them in with a big fan. If anyone know how to build like that it's MS. Sonys consoles have been 'console' builds. Very bespoke (too bespoke sometimes ps3), and this time is no different. I likeSony's approach more simply because I have a soft spot for over engineered stuff.
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Yeah I wouldn't say it's PC like but I can appreciate most PC builds that are small form factor strive to work with fewer number of larger fans and control airflow.
I'd argue MS has some fair engineering chops outside of the Xbox division as well. The surface line with its hinges, keyboards etc... They're pretty attractive feats of engineering really.
Same goes for Sony as well, they make some damn cool **** that isn't PlayStation.
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I like the expansion drives. They remind me of the ps2 memory cards. Thing is proprietary add ons are hit and miss though. For every memory card there is a UMD or psp memory stick. I'd also be concerned that the metal prongs on them wouldn't be enough to draw the heat away. SSDs, especially running at the kind of speed these do, get very hot.
PS5 is aiming to use off the shelf SSDs and that huge heat sink probably runs right across the back of them.
We'll see. Sony has definitely taking the nuke it from orbit approach.
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It'll depend on whether the rumbles about Series X's heat issues are correct or not. Some have commented that the expandable SSD storage becomes physically hot enough to contact burn your hands. Now, say that's true it doesn't at all mean that the system will suffer Red Ring syndrome but it would suggest that MS's cooling solution is less effective than Sony's albeit Sony has paid the price of oversizing the system itself.
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